Learn about our Commitment to Signal Integrity
High Speed Cable Assemblies
TR™ Multicoax delivers superior signal integrity from multiple high speed analog or digital channels up to 90 GHz+
Scalable, custom connectors available in a variety of form factors for next generation electronics systems
High Performance Sockets
Durable 40 GHz+ socket solutions offer low loss connection in a dense form factor for high performing devices
Host Compliance Test Fixtures
Ideal for 400G and 800G systems, users can easily characterize all high speed lines in a simple to use form factor
The Benefits of TR Multicoax
Ardent’s interconnect technology was born of a simple concept; What if we could eliminate the barrel and the plunger from a traditional “pogo” style spring pin and make the spring inside behave like an electrical contact instead of behaving like an inductor at multi-GHz speeds?
Our products are all based on solderless compression mount technology enabling more reliable and electrically repeatable performance over time and across programs. Our solderless compression products allow our customers to be agile in changing their designs without having to scrap entire projects and printed circuit boards with components soldered to the board. This leads to enhanced flexibility and cost savings.
Contacts can be arranged in pitches down to 0.4mm (grid array) and 2.54mm signal-to-signal (coaxial array) to scale up the number of lanes in any system.
Mil-Spec qualified and rated for thousands of cycles in the harshest environments, Ardent’s patented technologies are production proven with over 20 years of field use for test and measurement and OEM interconnect.
Ardent Concepts, Inc. Releases High-Density Ganged Coaxial Attenuators to Support Scale up of Cryogenic and Quantum Computing Applications
Thermalized low noise cryogenic attenuators mate seamlessly with Amphenol Ardent Concepts’ TR Multicoax™ connectors Ardent’s 16 channel Ganged Coaxial Attenuator is 94% more compact than 16 traditional SMA-style attenuators and
Amphenol Ardent Concepts and PHY-SI LLC Released QSFP DD 800G and OSFP 800G Form-Factor Host Compliance Test Fixtures with Access to all Lanes and Targeting IEEE 802.3ck CEI 112G-VSR Specification
Amphenol Ardent Concepts has released QSFP DD 800G (p/n PHI-SI-QSFP-DD-HCB-A4-32-2) and OSFP 800G (p/n PHI-SI-OSFP-HCB-A4-32-2) Host Compliance Test Fixtures (HCTF) for 800G system and component development in technical collaboration with
Amphenol Ardent Concepts Releases micro-LinkOVER™ as a Featured Near-Chip/On-Package Termination in Amphenol’s OverPass™ Series of PCB Trace Bypass Connectors
“We leveraged our experience designing and building reliable signal integrity connectors with compression mount technology in the near chip connector world to provide a connector capable of supporting current and upcoming 56G and 112G designs and beyond as customers think ahead towards 224G.”