CA Series Overview

CA™ Series Connectors and Interposers

Description

Ardent’s CA Series™ high performance 32 Gbps+ compression mount connectors & interposers offer exceptional signal integrity and high density for applications like high speed backplane, mezzanine, edge card, and optical at a 0.4 mm pitch in a pure vertical interface – no offset required. Reliable under extreme conditions CA Series™ connectors can stand up to the most demanding environmental factors. Custom configurations are available in a wide array of pitch, density, stack height, and orientation.

Applications

  • High Speed Mezzanines
  • Backplanes
  • Defense/Aerospace
  • Phased Array Radar
  • Probe Card Assemblies
  • Medical Devices
  • Optical Engines
  • Custom Applications

Board to Board

Description

Designed to your needs and delivered with short lead times. Our proven technology satisfies extremely high node count requirements without extreme force. A mezzanine connector from Ardent can be designed to work with <20 grams of force per node to maintain electrical connectivity. With contact heights as low as .030”, stack ups can be reduced without sacrificing signal integrity.

Applications

  • High Speed Mezzanines
  • High volume OEM applications
Board to Board Connector

Technical Information

Flex to Board

Description

Flex to board connectors utilize our revolutionary ‘wiping’ action contact technology available with our SC™ connectors. These connectors are ideal for ultra small flex to board connectors and sockets for either test or production use. Count on Ardent precision engineering capabilities to meet your specs and your short lead times.

Applications

  • Test & connector applications
  • High volume OEM applications
Flex to Board Connector
Flex to Board Connector

Technical Information

Chip to Board

Description

Patented chip to board interposer systems from Ardent Concepts are infinitely scalable in height, pitch and force. Ardent’s technology offers you multiple options for chip to board connectivity.

Ardent’s spring loaded connectors provide super high AC performance, and are more cost effective than traditional pogo pin connector solutions. With SP™ technology, LGA sockets, interposers and LGA connectors can be designed cost effectively and quickly. We can design custom interposers for your application in DAYS, with prototypes available in many cases in just 2 WEEKS.

Applications

  • BGA/LGA
  • FPGA
  • ASIC
  • MMICS
LGA Connector Specifications

Chip to Chip

Description

An interposer or LGA connector using the Connect-R™ technology enables a lower cost and is designed for high volume LGA connector applications where signal integrity is paramount and temperature and environmental conditions are challenging. This stamped, formed compression mount contact technology offers tighter pitch, higher signal integrity and a longer cycle life ideal for systems integrators and IC manufacturers.

A higher density alternative is our custom chip to chip connector or interposer using SP™ technology. This custom LGA interposer is specifically designed for OEMs for production volumes with primary benefits over the competition include a smaller footprint, faster and exceptional signal integrity.

Applications

  • Topside Interconnect
BGA
Chip to Chip Connector

Coaxial and Custom Pattern

Description

Low profile coaxial and custom pattern connectors.

Applications

 

Coaxial Pattern Interposer

Technical Information

Variable Height RF

Description

Designed for board-to-board stacking, these compression connectors provide reliable high speed connections at stack heights that meet your application requirements. Designed for 8 mm and below area array or coaxial patterns, board-to-board stacking has never been easier.

Applications

Variable Height RF

Technical Information

Optical Engines

Descrption

High speed input data rates in cost effective and real-estate friendly form factors. Ardent optical connectors have been extensively tested at 32 Gbps transmission speeds, and provide the critically low loss interface between backplane. The scalability of CR™ connector technology allows for solder-less high speed optical Electrical Module replaceability systems and the optical transceivers which are capable of pushing those signals out to 100 Gbps at the fiber.

Applications

  • High volume OEM applications
Optical

Technical Information

Space Transformer Interposers

Description

Available in modular designs and is a lower force drop-in replacement for massively parallel spring-pin connectors and conductive elastomeric contact sets. This space transformer interposer is a highly reliable discrete node z axis interconnect solution for super-high-node-count applications. Extremely low force, consistent DC resistance and exceptional AC performance for Vertical Probe Card interface applications.

Applications

  • Next generation SoC and high speed digital applications
Space_Transformer_Interposer
Space Transformer Interposer

Technical Information

Additional Information

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