CA Series Overview

Description

Designed to your needs and delivered with short lead times. Our proven technology satisfies extremely high node count requirements without extreme force. A mezzanine connector from Ardent can be designed to work with <20 grams of force per node to maintain electrical connectivity. With contact heights as low as .030”, stack ups can be reduced without sacrificing signal integrity.

Applications

• High Speed Mezzanines
• High volume OEM applications

Description

Flex to board connectors utilize our revolutionary ‘wiping’ action contact technology available with our SC™ connectors. These connectors are ideal for ultra small flex to board connectors and sockets for either test or production use. Count on Ardent precision engineering capabilities to meet your specs and your short lead times.

Applications

• Test & connector applications
• High volume OEM applications

Description

Patented chip to board interposer systems from Ardent Concepts are infinitely scalable in height, pitch and force. Ardent’s technology offers you multiple options for chip to board connectivity.

Ardent’s spring loaded connectors provide super high AC performance, and are more cost effective than traditional pogo pin connector solutions. With SP™ technology, LGA sockets, interposers and LGA connectors can be designed cost effectively and quickly. We can design custom interposers for your application in DAYS, with prototypes available in many cases in just 2 WEEKS.

Applications

• BGA/LGA
• FPGA
• ASIC
• MMICS

Description

An interposer or LGA connector using the Connect-R™ technology enables a lower cost and is designed for high volume LGA connector applications where signal integrity is paramount and temperature and environmental conditions are challenging. This stamped, formed compression mount contact technology offers tighter pitch, higher signal integrity and a longer cycle life ideal for systems integrators and IC manufacturers.

A higher density alternative is our custom chip to chip connector or interposer using SP™ technology. This custom LGA interposer is specifically designed for OEMs for production volumes with primary benefits over the competition include a smaller footprint, faster and exceptional signal integrity.

Applications

• Topside Interconnect

Description

Low profile coaxial and custom pattern connectors.

Applications

Description

Designed for board-to-board stacking, these compression connectors provide reliable high speed connections at stack heights that meet your application requirements. Designed for 8 mm and below area array or coaxial patterns, board-to-board stacking has never been easier.

Applications

Descrption

High speed input data rates in cost effective and real-estate friendly form factors. Ardent optical connectors have been extensively tested at 32 Gbps transmission speeds, and provide the critically low loss interface between backplane. The scalability of CR™ connector technology allows for solder-less high speed optical Electrical Module replaceability systems and the optical transceivers which are capable of pushing those signals out to 100 Gbps at the fiber.

Applications

• High volume OEM applications

Description

Available in modular designs and is a lower force drop-in replacement for massively parallel spring-pin connectors and conductive elastomeric contact sets. This space transformer interposer is a highly reliable discrete node z axis interconnect solution for super-high-node-count applications. Extremely low force, consistent DC resistance and exceptional AC performance for Vertical Probe Card interface applications.

Applications

• Next generation SoC and high speed digital applications

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